BH-201

Single/Dual

Epoxy-Amine or Dicyandiamide

Room Temperature or Heated

√

Suitable for spraying and potting (high halogen content), soft, resistant to thermal shock, damping

Cured at room temperature or heated with amine-based or thiol-based curing agents

BH-203

Single

Epoxy-Dicyandiamide

Above 130°C

√

Can be used as the base resin for sprayable medium-to-high temperature curing automotive reinforcement damping adhesives

Added to resin, combined with latent curing agents and accelerators

BH-205

Dual

Epoxy-Amine

Room Temperature or Heated

√

Soft adhesive, low strength, low viscosity, high halogen content

Cured at room temperature or heated with amine-based or thiol-based curing agents

BH-209

Single/Dual

Epoxy-Amine, Dicyandiamide

Room Temperature or Heated

√

√

Soft adhesive, good adhesion to soft materials, high halogen content

Cured at room temperature or heated with amine-based, thiol-based, or dicyandiamide curing agents

BH-014

Single

Epoxy-Dicyandiamide, etc.

Above 140°C

√

√

High temperature curing soft adhesive

Can be used as base resin to make soft adhesive, or added in small amounts as toughening agent

BH-016

Single

Epoxy-Dicyandiamide, etc.

Above 100°C

√

Reinforcement film, toughening for single-component epoxy adhesive, moderate strength, relatively low cost

Appropriately added to resin, addition amount is 20~30% of total resin weight

BH-026

Single

Epoxy-Dicyandiamide, etc.

Above 100°C

√

Prepreg toughening, high viscosity

Appropriately added to resin, addition amount is 20~30% of total resin weight

BH-133/133L

Dual

Epoxy-Amine or Anhydride

Room Temperature or Heated

√

Slightly low viscosity, good toughness

Can be used alone or added to resin, addition amount is 30~50% of total resin weight

102A

Dual

Epoxy-Amine

Room Temperature

√

√

√

Used for dual-component room temperature or heated curing epoxy high-elasticity soft adhesive, elongation can reach 300~500%

5~10% of total resin weight for toughening; use as base resin for elastic adhesive

102B-1

Dual

Amine-based

Medium to High Temperature

√

√

√

Used for dual-component medium to high temperature curing epoxy high-elasticity soft adhesive, elongation can reach 300%

When used as toughening agent, add to curing agent and age for one week; 5~10% of total resin weight for toughening; use as base resin for elastic adhesive

102B-2

Single

Epoxy-Dicyandiamide

Above 150°C

√

Automotive Industry

Added to resin, 5~10% of total resin weight for toughening

102C-1

Single/Dual

Epoxy-Amine or Dicyandiamide

Room Temperature or Heated

√

Suitable for most curing agents such as amines and anhydrides

Added to resin, addition amount is 20~30% of total resin weight

102C-1H

Single

Epoxy-Amine System

Room Temperature or Heated

√

Suitable for all amine-based systems, low addition amount, high strength

Added to resin, addition amount is 15~25% of total resin weight

102C-2

Dual

Partial Amine-based

Room Temperature or Heated

√

Epoxy-Polyamide, Polyetheramine, T-31, Anhydride and other curing agents

Added to resin, addition amount is 20~30% of total resin weight

102C-3

Single/Dual

Epoxy-Amine or Dicyandiamide

Room Temperature or Heated

√

Suitable for most curing agents, low yellowing tendency, high adhesion

Added to resin, addition amount is 30~50% of total resin weight

102C-4L

Single

Epoxy-Amine or Dicyandiamide

Room Temperature or Heated

√

√

√

√

Suitable for most curing agents, low addition amount, minimal increase in adhesive viscosity

Added to resin, mixing temperature not exceeding 80°C; 8~12% of total formula weight as toughening agent, use as base resin for elastic adhesive

102C-4H

Dual

Epoxy-Amine

Room Temperature or Heated

√

√

Suitable for most amine-based curing agents, low addition amount, minimal increase in adhesive viscosity, moderate strength.

Added to resin, mixing temperature not exceeding 80°C; use as base resin for soft adhesive; 10~15% of total formula weight as toughening agent

102C-4T

Dual

Epoxy-Amine

Room Temperature or Heated

√

√

Dual-component epoxy elastic soft adhesive, elongation can reach 200-300%

Heated curing is recommended, mixing temperature not exceeding 80°C

102C-5/H

Single

Epoxy-Dicyandiamide

Above 130°C

√

Automotive structural adhesive, high strength, toughening for epoxy-dicyandiamide system

Excellent low-temperature impact resistance, high peel strength

102C-5H: low crystallization, higher peel strength

Added to resin, mixing temperature not exceeding 80°C, dosage is 20~25% of total formula weight (including fillers)

102C-8

Single/Dual

Epoxy-Amine or Dicyandiamide

Room Temperature or Heated

√

Suitable for most curing systems, high peel strength, low-temperature impact resistance, low moisture absorption, heavy corrosion protection

Added to resin, addition amount is 20~40% of total resin weight

TH-5

Dual

Epoxy-Amine

Room Temperature or Heated

√

√

√

Suitable for most amine-based curing agents, low addition amount, minimal increase in adhesive viscosity, moderate strength, slightly low viscosity.

Added to resin, mixing temperature not exceeding 80°C; use as base resin for soft adhesive; 10~15% of total resin weight as toughening agent

TH-6

Dual

Epoxy-Amine

Room Temperature or Heated

√

√

√

√

Suitable for most amine-based curing agents, low addition amount, minimal increase in adhesive viscosity, slightly low viscosity.

Added to resin, mixing temperature not exceeding 80°C; use as base resin for elastic adhesive; 8~12% of total formula weight as toughening agent

TH-6F

Dual/

Single

Epoxy-Anhydride/Dicyandiamide

Heated

√

√

√

√

Suitable for toughening most anhydride-dicyandiamide curing systems, low addition amount, minimal increase in adhesive viscosity.

Phase separation forms sea-island structure after curing, Tg basically does not decrease.

Added to resin, mixing temperature not exceeding 80°C; use as base resin for elastic adhesive; 8~12% of total formula weight as toughening agent

TH-7

Dual

Epoxy-Amine

Room Temperature or Heated

√

√

√

√

Suitable for most amine-based curing agents, low addition amount, minimal increase in adhesive viscosity, slightly high viscosity.

Added to resin, mixing temperature not exceeding 80°C; use as base resin for elastic adhesive; 8~12% of total formula weight as toughening agent

TH-8

Single

Epoxy-Dicyandiamide

Above 130°C

√

√

√

√

Automotive structural adhesive, high strength, toughening for epoxy-dicyandiamide system

Excellent low-temperature impact resistance, high peel strength

Added to resin, mixing temperature not exceeding 80°C; use as base resin for elastic adhesive; 10~20% of total formula weight as toughening agent